BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C.
Cross-section analysis is a very useful way of determining the construction and material composition of electronic devices. The FP device is potted in epoxy resin. After curing, the sample is sequentially grinded up to reach the plane of interest. Then, the specimen is subjected...
At Alter Technology, we can perform 3D characterization using Confocal Laser Scanning Microscopy and the world’s most integrated and flexible test equipment for nondestructive 3D dimensional characterization, helping designers to get in-depth information about their prototypes.
This technique combines to two inspection methods (microscopy and fluorescent dye penetrant inspection) commonly used for the detection of surface anomalies such as cracks, porosity, laps, delaminations, and other discontinuities. This joint approach is intended to highlight and...
Raman thermometry is a thermal characterization technique which makes use of Raman scattering phenomena to determine the local temperature in microelectronics systems. Non-contact character. High spatial resolution (sub-micron scale). In-depth analysis within IR-transparent...
IR thermal microscopy (or infrared radiation thermometry) analyses the spatial distribution of the emitted infrared radiation either over the device surface or eventually inside the inspected device. This technique enables us to obtain 2D temperature maps, which are used to...
This type of inspection is performed using an electron microscope which produces images of a sample by scanning it with a focused electron beam. Interaction between the electrons and atoms in the sample generates signals that contain information about the sample’s surface...
This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray)...
Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials. Since it is destructive to the part, FIB technology is used for micro-sectioning in...
