Challenges with image sensors vs. standard microelectronics packaging
- Sensor and filter position, tilt and rotation.
- Particulate control
- Thermal management / noise reduction
- Stray light
Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane Array sensor chips into ceramic packages.
- Service offering:
- Bespoke package design
- Optics and window design
- Materials procurement
- Flexible – wide range of form factors
- Thermal and mechanical modelling
- Process development and qualification
- Automated volume assembly
- Space heritage for Image sensors
- Assembly Capabilities:
- Precision die and filter placement
- Specialist particle control procedures
- Stacked die capability
- SMT of passive components
- Flex circuit attach
- Flip chip attach & Au stud bumping
- Optimised wafer saw process for detectors
- Wafer saw for glass and filter substrates
- Process Highlights
- Automated Die placement accuracy +/-15µm
- Rotation control 2° to 5°, tilt control <50µm
- Programmable epoxy dispensing pattern
- Thermal or UV snap cure to maintain die position
- Controlled clean environments – ISO7 cleanroom & laminar flow (ISO5)
- CO2 cleaning optimised for sensor and glass.
- Hermetic seam sealing in inert N2 environment
- <5000ppm moisture content
- Black dam dispensing for stray light
- Standard Materials
- Package Substrate: High temp co-fired ceramic
- Lid: Optical grade Borosilicate glass
- Die attach adhesive: Conductive or Non-conductive Epoxy
- Wide range of epoxies in house
- Wire: 17µm-33µm diameter, Au ball bonding
- Wedge bonding for high-rel applications
- Glass Adhesive: Thermal or UV attach epoxy
Test Capability (Alter Technology)
- Sensor Characterization
- Under illumination, uniform light source.
- Dark current characterization
- Custom electronics developments
- Temperature stabilization setups
- Photodiode Array
- Precision FemtoAmp Dark Current measurements
- Radiation Test
- Proton 10MeV to 200MeV
- Gamma Low & High dose rates
- Heavy Ion Beam
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Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to the assembled product.
Últimas entradas de Optocap (ver todo)
- Image Sensor Assembly - 1st febrero 2019
- Pick and Place - 27th noviembre 2018
- Servicios unión de troqueles - 26th noviembre 2018
