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    • Radiation Testing Services Electronic Parts
    • COTS Commercial Off-The-Shelf | EEE Parts
    • Acceptance Tests
    • Counterfeit Detection, Authenticity Tests
    • Evaluation / Qualification
    • Electrical Characterization
    • Failure Analysis
    • Material & Processes
    • Microsectioning
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    • Parts Engineering and Logistics – EEE Parts
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    • Scanning Acoustic Microscopy C-SAM
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    • Tin Whiskers Growth
    • Vibration Testing | EEE Parts
    • Short Technical Notes – Discover how our laboratories work and how the components that need to be tested are treated.
  • Certification Equipment Testing
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Tin Whisker Growth Conclusions
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  • Tin Whiskers Growth

Tin Whisker Growth Conclusions

by Media ATN

This study corroborates that the Nickel (Ni) underlayer recommended by the industry as a diffusion protective barrier of the contact, is effective in delaying Stannum (Sn) whisker growth under ambient temperature/humidity storage conditions or during temperature cycling. Continue reading

Tin Whisker Growth Results
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  • Tin Whiskers Growth

Tin Whisker Growth Results

by Media ATN

Tin Whisker Growth Results comes after the investigations and thanks to the methods carried out by Alter Technology, we can reach some conclusions. An important starting point must be stressed that NONE OF THE “AS RECEIVED” SMD DEVICES POSSESSED WHISKERS. It was confirmed by... Continue reading

Tin Whisker Growth Experimental Methods
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  • Tin Whiskers Growth

Tin Whisker Growth Experimental Methods

by Media ATN

The surface mount device beads under study have two rectangular contacts at opposite sides. With bends of 90 degrees that have an approximate planar surface of 3.048 mm2 each. In order to comply with the standard JESD22-A121, 12 leads on at least 6 components must be examined... Continue reading

Tin whisker growth on surface mount devices: a study using standarized test conditions
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  • Tin Whiskers Growth

Tin Whisker Growth

by Media ATN

The Tin Whisker is a conductive hairy-like crystalline structures of tin that grow spontaneously from a tinned surface, usually as a result of stress of some sort, and maybe long enough to cause a big problem for those applications demanding high level of reliability. In this... Continue reading

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