Optocap has experience in the assembly and packaging of MEMS devices.
Optocap offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process.
There are a number of specific technical challenges related to MEMS assembly such as special handlingtechniques and the restriction that many standard fluxes, adhesives and solvents can’t be used.
As a result Optocap has developed an extensive “tool-kit” of material and process knowledge in all key steps of the assembly process including wafer saw, die attach, flip chip attach, wire bonding, and encapsulation. This Tool-Kit of process and material knowledge is used to reduce development times, reduce risk and reduce development and manufacturing risks for customers.
Advanced packaging techniques such System-in-Package (SiP) and Wafer Scale Packaging (WSP) have also been developed to support the increasing trends in miniaturization and lower costs.
Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product.
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