Optocap have experience in the assembly and packaging of a wide range of Photonic Integrated Circuit (PIC) devices including Silicon PIC and InP PIC devices. A PIC is a photonic integrated circuit that integrates multiple photonic functions, such as lasers, detectors, modulators...
Frequency-stabilised lasers are key enablers of quantum technologies, with many cold atom applications reliant on multiple lasers. Quantum technology applications such as atomic clocks, magnetometers and gravitometers are now emerging from the laboratory and confronting the...
The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products. Incorporates a number of integrated circuits in a single package in a way that maintains the demanding form factor...
Challenges with image sensors vs. standard microelectronics packaging Sensor and filter position, tilt and rotation. Particulate control Thermal management / noise reduction Stray light Optocap’s Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane...
Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including; CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA
Alter Technology (formerly Optocap) has experience in the assembly and packaging of MEMS devices. Alter Technology (formerly Optocap) offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on...
