Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process. Thermal...
Environmental testing provides a useful tool for evaluation, qualification and screening of EEE components for high-reliability applications. Various types of stresses can be applied to the products in a controlled manner thus allowing to accelerate the appearance of latent...
Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the component so that the gas content can be extracted and subsequently...
determine the ability of parts and solder interconnects to resist extremely low and extremely high temperatures, as well as their ability to endure cyclical exposures to temperature extremes. Permanent changes to the electrical or physical characteristics of the devices under...
Under certain conditions and in accordance with the ECSS-Q-ST-60-13C standard on the use of commercial EEE parts in space applications, this test may be replaced by the Highly Accelerated Stress Test (HAST) with the test duration reduced to 96 hours. See HAST page for further...
The aim of this process is to verify the conformity of the exterior of electrical, electronic and electromechanical components (EEE parts) with the acquisition document. The following aspects should be considered: Marking Aspect of Materials Workmanship Sealing Leads Feedthroughs
This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray)...
The aim of this destructive test is to demonstrate that the internal materials, design, construction and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed to examine unsealed devices prior to capping to verify that...
Receiving Inspection is an acceptance activity aimed at confirming that the components received are in accordance with the requirements of the applicable purchase order. Our inspectors verify all raw materials by reconciling the purchase order requirements with the packing slip...
The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other...
This test is performed to verify the structural quality of the glassivation layer in aluminium metallized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and...
Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.
