Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.
LED is a two-lead semiconductor light source. LEDs are small and are commonly used as indicator lamps in electronic devices Due to the increased design flexibility, efficient use of power and environmental benefits the use of LEDs as lighting, data communication and signalling...
High brightness semiconductor lasers are potential transmitters for future space lidar systems. In the framework of the European Project BRITESPACE, we propose anHigh Brightness Semiconductor Lasers allsemiconductor laser source for an Integrated Path Differential Absorption...
This test is performed to verify the structural quality of the glassivation layer in aluminium metallized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and...
