We celebrate our thirtieth anniversary, and look forward to keep working for many more years.
Microsection analysis is performed on an assembled through-hole device as a part of failure analysis. Cross-section through the plane of interest can provide helpful information about solder defects, PCB inner layers, and internal construction. As a part of failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.
The use of radiation tools is justified as a complement of radiation test to verify and optimize the radiation hardness assurance process in the new space market and reduce some cost without a significant loss of the confidence level.
An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and highlights the delaminated areas. In addition, A-scan inspection is used to confirm these findings.