We celebrate our thirtieth anniversary, and look forward to keep working for many more years.
Since the Industry 4.0 concept was introduced into the market, factories and manufacturing processes have experienced different transformations to make them smarter, by linking various up to now isolated disciplines, from design to production, automated inspections, embedded sensors to give an authoritative overview of product status and testing. Any space customer is aware of it and about the unquestionable benefits that will bring for new space missions.
Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances, especially for high-speed signals. Reduce device size and weight,…, etc.
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems. Typical non-destructive testing activities involving EEE parts are grouped in three main categories: • Functional inspection (electrical tests to find functional failures) • External inspection of the package • Internal inspection of the structure