We celebrate our thirtieth anniversary, and look forward to keep working for many more years.
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Electronic components for motor vehicles: the solution in New Space?
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Non-destructive detection of micrometric internal features within EEE microelectronic systems.
Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.
Acoustic Inspection of Hybrid Systems on Laminated Substrates
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.
