Package Design and Modelling
Our company utilize Design for manufacturing techniques to ensure that any designs are compatible with a low cost, high yield assembly process.
Alter Technology (formerly Optocap), mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, high power laser coupling.
During package design, consideration is given to the selection of suitable component materials, die attach materials, based upon the intended in-field use and performance requirements.
Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.