Package Design and Modelling
Our company utilize Design for manufacturing techniques to ensure that any designs are compatible with a low cost, high yield assembly process.
Optocap’s mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, high power laser coupling.
During package design, consideration is given to the selection of suitable component materials, die attach materials, based upon the intended in-field use and performance requirements.
Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.
This in turn drives mechanical piece-part tolerances, whether these are ±10um or ±1um. Mechanical drawing generation includes the dimensional and surface quality definitions and tolerances required to achieve the module performance and reliability
It is crucial that the package design adheres to the package design rules but also the design rules for the assembly process, such as wire bond design rules, plating specifications to enable soldering of components and appropriate pattern recognition points to enable automated accurate pick and place of components.
Thermo-mechanical finite element modelling is used in conjunction with our package design activities to assess temperature gradients within the device and the package and to understand the package mechanical stability.
This activity drives the definition and design of the package, layout of components within the package, material selections, external heat-sinking options, and appropriate joining materials to ensure expansion matching of materials. If the heat is not effectively dissipated from the device then the performance can be severely impact.
Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product.
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