Package Design and Modelling

Our company utilize Design for manufacturing techniques to ensure that any designs are compatible with a low cost, high yield assembly process.

Alter Technology (formerly Optocap), mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, high power laser coupling.

During package design, consideration is given to the selection of suitable component materials, die attach materials, based upon the intended in-field use and performance requirements.

Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.

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