Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances...

The advent of the chirped-pulse amplification (CPA) technique has revolutionized the physics of particle accelerations. Compared to conventional accelerator, lasers can produce ultra short particle beams with high brilliance and broad energy spectrum. Moreover Laser technology...

A novel integrated optical source capable of emitting faint pulses with different polarization states and with different intensity levels at 100 MHz has been developed. The source relies on a single laser diode followed by four semiconductor amplifiers and thin film polarizers...