Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad. Continue reading
Optocap has extensive experience the packaging and assembly of Concentrated Photovoltaic (CPV) devices. Optocap offers customers support in both prototype/process development for CPV packaging as well as volume manufacturing capability. Continue reading
Optocap has detailed experience in assembly of a wide range of Microelectronic devices including the following; CMOS Sensors; CMOS Camera Modules; MEM’s; Capacitive, Optical, Isolation structures, pressure sensor MEM’s; Sensors; Optical sensors/strain gauges; OLED Display; HB... Continue reading
