Bakeout and very Extreme temperature characterization
The development of new high temperature electronics (HTE)/systems is the key to achieving high reliability safety critical operations in aerospace, automotive and well-logging applications.
Our company provides specific capabilities to for reliability testing the standard -55ºC / +125ºC MIL temperature range conditions.
Related Activities
- Components reliability assessment to ensure mission performance
- Characterization of existing technologies under such extreme temperature conditions
- Understanding of failure mechanism
- Development of specific NEW parts for very extreme application
- Assessment on new packages and assembly methods
The INNOVATION department is open to new challenges and developments in collaboration with customer requirements
SERVICES & CAPABILITIES
Show All
(50)
Innovation (50)
Sort By None Sort By Date Sort By Title Sort By Author
Fabrication technology and packaging strategy for 300V-5A Silicon Carbide Schottky diodes with a wide temperature operation range capability...
New test methodologies: Combined Vacuum Temperature and Motion; Combined strain and extreme temperature; Combined radiation and cold temper...
This article describes the setup developments and some of the results obtained for the temperature characterization from -190ºC to more than...
New failure modes not observed in Silicon appear while testing SiC MOSFET and Schottky diodes and under heavy ions radiation. Gate damage in...
The Aerospace and Electronic Businees Unit is part of the Hirex Engineering, one of the Companies within the Alter Technology, owned by TÜV...
After expose key elements on the evaluation of Optoelectronic Components for Space Applications, where thermal vacuum and other environmenta...
A novel integrated optical source capable of emitting faint pulses with different polarization states and with different intensity levels at...
This paper describes the activities and results of an ESA-funded project concerned with the assessment of optical amplifier technologies and...
The Reliability Assessment of Area PIN SI Photodiodes was a exhibition theme in the First International Symposium on Reliability of Optoelec...
Quantum communications offers many advantages for secure data transmission, e.g. confidentiality, integrity, eavesdropper’s detectability. I...
There are well-known advantages to using these photonic technologies in space, such as the limited generation of noise, electromagnetic immu...
The use of radiation tools is justified as a complement of radiation test to verify and optimize the radiation hardness assurance process in...
New space missions include more extreme requirements of storage and operational temperatures and vacuum conditions exceeding standard -55ºC...
For decades, military/space electrical, electronic, and electromechanical (EEE) parts have proved to be suitable for use in military and spa...
This study aims to support the development of discrete European radiation hardened SiC power MOSFET for use in space applications by means o...
Since the Industry 4.0 concept was introduced into the market, factories and manufacturing processes have experienced different transformati...
Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and packa...
The procurement, evaluation, screening and lot acceptance of RF devices in leadless SMD packages to be used in spacecraft applications show...
A compact balanced-to-balanced diplexer composed of two balanced bandpass filters is proposed in this letter. The balanced filters are imple...
Load More
