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  • alter technology madridEngineering and testing of Hi Rel Electronic Component
    • Radiation Testing Services Electronic Parts
    • COTS Commercial Off-The-Shelf | EEE Parts
    • Acceptance Tests
    • Counterfeit Detection, Authenticity Tests
    • Evaluation / Qualification
    • Electrical Characterization
    • Failure Analysis
    • Material & Processes
    • Microsectioning
    • Microwave & RF testing
    • Parts Engineering and Logistics – EEE Parts
    • Procurement Electronic Components | EEE Parts
    • Relifing
    • Scanning Acoustic Microscopy C-SAM
    • Screening
    • Tin Whiskers Growth
    • Vibration Testing | EEE Parts
    • Short Technical Notes – Discover how our laboratories work and how the components that need to be tested are treated.
  • Certification Equipment Testing
  • DRONES – Remotely Piloted Aircraft Systems RPAS
  • Packaging & Assembly
  • Innovation
  • News
  • Companies
    • Alter Technology
    • ALTER FRANCE
    • ALTER UK

Video Channel

Alter Technology Web Project TV

Services, capabilities, webinar´s, broadcast.

Corporative Site

Cross sectioning Electronic Components
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Cross sectioning Electronic Components | EEE Parts

by Media ATN

The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing... Continue reading

C-SAM Test
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  • Acceptance tests
  • Counterfeit detection
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  • Screening

Scanning Acoustic Microscopy CSAM | EEE Parts

by Media ATN

Scanning Acoustic Microscopy (SAM) is an inspection that uses focused sound to investigate, measure, or obtain an internal image of an object. It is commonly used in failure analysis and non-destructive evaluation. The semiconductor industry has found the SAM, particularly the C... Continue reading

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  • Evaluation / Qualification
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  • Relifing
  • Screening

Thickness Verification – HI Rel Electronics Parts

by Media ATN

The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of coated product as well as control of... Continue reading

Bond pull test
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  • Acceptance tests
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Bond Pull Test Electronic Component | EEE Parts

by Jesús Enrique Barbero Muñoz

The purpose of this test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term... Continue reading

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