Raman thermometry is a thermal characterization technique which makes use of Raman scattering phenomena to determine the local temperature in microelectronics systems. Non-contact character. High spatial resolution (sub-micron scale). In-depth analysis within IR-transparent... Continue reading
IR thermal microscopy (or infrared radiation thermometry) analyses the spatial distribution of the emitted infrared radiation either over the device surface or eventually inside the inspected device. This technique enables us to obtain 2D temperature maps, which are used to... Continue reading
X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the... Continue reading
XRF is a non-destructive and quick analytical tool to determine the chemical elements present in the specimen. In particular, it combines low detection limit (particularly in the case of heavy elements) with quick and easy sample preparation. Continue reading
Microsectioning and materialographic inspection are mandatory in different verification and qualification standards issued by international agencies and public bodies such as the European Space Agency (ESA), the Defense and Logistics Agency (MIL DLA specifications) and the IPC... Continue reading
Tin Whisker Growth Results comes after the investigations and thanks to the methods carried out by Alter Technology, we can reach some conclusions. An important starting point must be stressed that NONE OF THE “AS RECEIVED” SMD DEVICES POSSESSED WHISKERS. It was confirmed by... Continue reading
This study corroborates that the Nickel (Ni) underlayer recommended by the industry as a diffusion protective barrier of the contact, is effective in delaying Stannum (Sn) whisker growth under ambient temperature/humidity storage conditions or during temperature cycling. Continue reading
The new century brought to the space a new type of solar cells with higher efficiencies and better resistance to radiation damage such as those based on the III-V single-junction GaAs. This new material opened the possibility of further improvement by the development of the... Continue reading
Submicrometric-nanometric objects nowadays present in the design of integrated circuits induce singular heat transport phenomena leading to the formation of hot-spots or strong temperature gradients at specific local points, which compromises the suitable operation and... Continue reading
The surface mount device beads under study have two rectangular contacts at opposite sides. With bends of 90 degrees that have an approximate planar surface of 3.048 mm2 each. In order to comply with the standard JESD22-A121, 12 leads on at least 6 components must be examined... Continue reading
The Tin Whisker is a conductive hairy-like crystalline structures of tin that grow spontaneously from a tinned surface, usually as a result of stress of some sort, and maybe long enough to cause a big problem for those applications demanding high level of reliability. In this... Continue reading
The use of differential (or balanced) digital and analog circuits for information processing has increased in recent years . When transmitting high-speed electrical signals, both the electromagnetic (EM) fields generated by the transmitted signals and the ground plane return... Continue reading
