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  • alter technology madridEngineering and testing of Hi Rel Electronic Component
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  • alter technology madridEngineering and testing of Hi Rel Electronic Component
    • Radiation Testing Services Electronic Parts
    • COTS Commercial Off-The-Shelf | EEE Parts
    • Acceptance Tests
    • Counterfeit Detection, Authenticity Tests
    • Evaluation / Qualification
    • Electrical Characterization
    • Failure Analysis
    • Material & Processes
    • Microsectioning
    • Microwave & RF testing
    • Parts Engineering and Logistics – EEE Parts
    • Procurement Electronic Components | EEE Parts
    • Relifing
    • Scanning Acoustic Microscopy C-SAM
    • Screening
    • Tin Whiskers Growth
    • Vibration Testing | EEE Parts
    • Short Technical Notes – Discover how our laboratories work and how the components that need to be tested are treated.
  • Certification Equipment Testing
  • DRONES – Remotely Piloted Aircraft Systems RPAS
  • Packaging & Assembly
  • Innovation
  • News
  • Companies
    • Alter Technology
    • ALTER FRANCE
    • ALTER UK

Video Channel

Alter Technology Web Project TV

Services, capabilities, webinar´s, broadcast.

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Continue reading
  • Evaluation / Qualification
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  • Screening

Thickness Verification – HI Rel Electronics Parts

by Media ATN

The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of coated product as well as control of... Continue reading

Bond pull test
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  • Acceptance tests
  • Evaluation / Qualification
  • Failure analysis

Bond Pull Test Electronic Component | EEE Parts

by Jesús Enrique Barbero Muñoz

The purpose of this test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term... Continue reading

Burn-in-Test-Electronic-Components-EEE-Parts
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  • Evaluation / Qualification
  • Screening

Burn-in Test, Electronic Components | EEE Parts

by Antonio Amigo

Burn-in test is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Continue reading

Destructive Physical Analysis DPA
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  • Acceptance tests

Destructive Physical Analysis DPA | EEE Parts

by Lope Rescalvo

Destructive Physical Analysis, dpa , is a systematic, logical, detailed examination of EEE parts during various stages of physical disassembly. This activity is performed to verify that the manufacturing lot quality and construction are in accordance with the detailed... Continue reading

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