In acoustic microscopy, resolution and inspection depth are inversely related parameter that depend on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must to be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides:
- Detection of ultra-thin (submicrometric) delamination in multilayer systems.
- Micrometric lateral resolution.
In addition, the technique permits the internal inspection of different cutting planes (non-destructive virtual cross-section) and the simultaneous analysis of defects and interfaces at different depths. This provides the technique with in-depth multifocal inspection capabilities which in turn are used for the tomographic 3D reconstruction of complex internal structures.
In plane analysis (C-Scan mode)
This scanning mode analyses the internal structure at a fixed depth within a selected thickness. By this way, it generates a stratified image of the component. In the resulting image the higher intensity of the acoustic waves reflected at air interfaces and defects provides a clear contrast. Thus, this scan mode is particularly sensitive to air voids and delaminations; and permit the defection sub-micrometric-thick features.
Virtual cross-section (B-Scan mode)
In this case the system combines multi-depth analyses sequentially conducted along a given line to reconstruct a depth resolved cross section image as the one in the figure.
Multi-focus inspection (X-Scan mode)
For multi-focus inspection purposes the system accumulates several C-scans simultaneously registered at selected depths. This allows us to inspect different materials and interfaces within a single scan process.
3D Tomography (Z-Scan mode)
The 3-dimensional information acquired in X-scans permit the tomographic reconstruction of the system internal structure.
Senior Materials and Test Engineer
Francisco Javier has a Degree in Physics and a Ph.D. in Materials Science both from the University of Seville and has conducted different Post-doctoral stays at the University of Mons (Belgium), University of Trento (Italy) and the Spanish National Research Council
He works as materials and physical test senior engineer within the Destructive and Physical Analysis Department. In Alter Technology laboratories, his main tasks address the characterization of EEE parts by advanced microscopy techniques and the conception of new test procedures.