C-SAM Inspection of Microelectronics parts

Internal (invisible) fabrication and materials defects can critically compromise the performance of encapsulated microelectronics parts. Similarly, accidental constructional failures (missing parts) and counterfeit suppose and non-negligible issue in the current EEE market. Therefore, reliable non-destructive inspection tools are essential for the for the suitable identification and screening of internal defect in encapsulated systems.

However, internal non-destructive inspection becomes a challenging task because of the higher complexity and miniaturizations of current EEE assemblies, for instance chip-scale packages and 3D integrated circuits stacks. In this regards SAM is one of the preferred non-destructive method for the assessment of microelectronic assemblies and components.

  • Plastic encapsulated IC
  • Flip Chip systems (CGA, FCBGA, PBGA, FPBGA…)
  • Bonded Wafers
  • Printed Circuit Boards
  • Capacitors
  • MEMS…

Amongst other types of failures Acoustic techniques are particularly suitable for the detection of those irregularities involving materials and density changes including voids and porosity as well as cracks and delamination. In particular, acoustic microscopy has proved to be the ultimate non-destructive approach for the identification of ultrathin air delamination in multilayer systems, being sensitive to air features of sub-micrometric thickness. Other features typically detected by the techniques in microelectronic systems are:

General failures:

  • Non-bonded interfaces (e.g. bonded wafers)
  • Die tilt or cupping
  • Interlaminate disbonding
  • Porous or insufficient die attach
  • Die cracks
  • Molding compound voids
  • Chip package cracks
  • Delamination within the substrate

Ball Grill Arrays and specific failures.

  • Defects in Cu pillars, solder balls and TSVs
  • Excessive filler height or die attach material
  • Solder mask or “lead finger” disbanding
  • BGA package cracks

Integrated circuits specific failures

  • IC package cracks (“popcorn” cracks)
  • Lead frame delamination

Hybrid and Multi-Chip Module (MCM) specific failures

  • Heat sink solder bond integrity
  • Lid seal bond quality
  • Insufficient solder material
  • Excessive solder reflow
  • Seal integrity