Since the Industry 4.0 concept was introduced into the market, factories and manufacturing processes have experienced different transformations to make them smarter, by linking various up to now isolated disciplines, from design to production, automated inspections, embedded... Continue reading
Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances... Continue reading
The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components. This also entails a close collaboration between the manufacturing and... Continue reading
This study aims to support the development of discrete European radiation hardened SiC power MOSFET for use in space applications by means of studying the gate oxide in terms of SEE and TID as one of the key parameters in the future development of these devices. The resistance... Continue reading
The new century brought to the space a new type of solar cells with higher efficiencies and better resistance to radiation damage such as those based on the III-V single-junction GaAs. This new material opened the possibility of further improvement by the development of the... Continue reading
The objective of this activity is to examine the suitability of solid state fiber optic switches to meet future space applications and define a complete technology development and space qualification roadmap for the most suitable solid state optical switch technology for future... Continue reading
The use of differential (or balanced) digital and analog circuits for information processing has increased in recent years . When transmitting high-speed electrical signals, both the electromagnetic (EM) fields generated by the transmitted signals and the ground plane return... Continue reading
Surface contamination involving micrometric particles, microbiological agents, molecular adsorbate and others, represent a significant hazard in many areas of industry. For instance, a high level cleanliness is a critical requirement that any EEE device has to fulfil at any... Continue reading
The procurement, evaluation, screening and lot acceptance of RF devices in leadless SMD packages to be used in spacecraft applications show unexpected difficulties whenever degolding or retinning processes are required. This is associated to the induced lack of coplanarity in... Continue reading
A compact balanced-to-balanced diplexer composed of two balanced bandpass filters is proposed in this letter. The balanced filters are implemented using compact edge-coupled square split-ring resonators. The design methodology is based on the standard coupled-resonators filter... Continue reading
New space missions include more extreme requirements of storage and operational temperatures and vacuum conditions exceeding standard -55ºC / +125ºC conditions Miniaturization implies increase higher power dissipation and hence max junction and PCB temperatures. Continue reading
For decades, military/space electrical, electronic, and electromechanical (EEE) parts have proved to be suitable for use in military and space applications. [NASA's Office of Safety & Mission Assurance (OSMA) evaluates newly available and advanced electronic parts for programs... Continue reading
