Why LED Chip-on-Board?

  • Cost effective alternative to incandescent and fluorescent light sources
    • Increased life span and efficiency
    • System integration, no user serviceable parts
    • Reduced total cost of ownership
    • Customised array size and shape
    • Application specific wavelengths
  • Chip-on-board vs. surface mounted LEDs:
    • Low-pitch / higher density arrays
    • Improved efficiency and heat dissipation
    • No over-molding material boosts light output
    • Fewer interconnects reduce reliability risk

Why Optocap?

  • Value Proposition
    • Experienced LED CoB module provider
    • Flexible and customisable platform
    • Reduced time to market
      • Product specific experience and processes
      • Established material supply chain
    • Reduced technical risk
      • Existing design and process knowledge
      • Rapid prototyping on production tools
    • Reduced cost
      • No capex requirement for customer
      • Volume manufacturing capacity
      • >200K LED placements per month.
  • Concept to product:
    • Substrate design & sourcing, ceramic, IMS, FR4.
    • Sourcing tested & binned LED dies
    • Optical and thermal modelling
    • Full range of volume assembly services
    • Functional test
    • Characterisation

Assembly Capabilities

  • Die Attach
    • Ag epoxy stamping or dispense
    • Sintering epoxy materials
    • Soldering
    • Pick from film/frame, waffle or gel pack.
    • Flip-chip attach & Au stud bumping
  • Wire Bond
    • 17 to 50um Au ball bonding
    • Plasma clean for improved adhesion
    • Encapsulation Options
    • Frame laser cutting and attach
    • Glass cover attach
    • Silicone encapsulation
    • Dome attach
    • Specialist processes for mixing and degassing
  • QC checks
    • Die shear and wire strength tests
    • Placement accuracy measurements

Test Capabilities

  • In-house functional “light-up” testing
    • Rapid feedback to the assembly line.
  • Characterisation capabilities (Alter)
    • Data logger for multiple LED measurements
    • Linear stages for placing Photodiode in front of each LED element
    • Optical Spectrum Analyzer covering from 190nm to 5000nm
    • Coupling to integrating sphere possible

This post is also available in: Spanish

Tagged as: