Why LED Chip-on-Board?

  • Cost-effective alternative to incandescent and fluorescent light sources
    • Increased life span and efficiency
    • System integration, no user-serviceable parts
    • The reduced total cost of ownership
    • Customised array size and shape
    • Application-specific wavelengths
  • Chip-on-board vs. surface mounted LEDs:
    • Low-pitch / higher density arrays
    • Improved efficiency and heat dissipation
    • No over-moulding material boosts light output
    • Fewer interconnects reduce reliability risk

Why Alter Technology UK?

  • Value Proposition
    • Experienced LED CoB module provider
    • The flexible and customisable platform
    • Reduced time to market
      • Product-specific experience and processes
      • Established material supply chain
    • Reduced technical risk
      • Existing design and process knowledge
      • Rapid prototyping on production tools
    • Reduced cost
      • No capex requirement for customer
      • Volume manufacturing capacity
      • >200K LED placements per month.
  • Concept to a product:
    • Substrate design & sourcing, ceramic, IMS, FR4.
    • Sourcing tested & binned LED dies
    • Optical and thermal modelling
    • Full range of volume assembly services
    • Functional test
    • Characterisation

Assembly Capabilities

  • Die Attach
    • Ag epoxy stamping or dispense
    • Sintering epoxy materials
    • Soldering
    • Pick from film/frame, waffle or gel pack.
    • Flip-chip attach & Au stud bumping
  • Wire Bond
    • 17 to 50um Au ball bonding
    • Plasma clean for improved adhesion
    • Encapsulation Options
    • Frame laser cutting and attach
    • Glass cover attach
    • Silicone encapsulation
    • Dome attach
    • Specialist processes for mixing and degassing
  • QC checks
    • Die shear and wire strength tests
    • Placement accuracy measurements

Contact us for more information

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