Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances...
Optocap have experience in the assembly and packaging of a wide range of Photonic Integrated Circuit (PIC) devices including Silicon PIC and InP PIC devices. A PIC is a photonic integrated circuit that integrates multiple photonic functions, such as lasers, detectors, modulators...
Frequency-stabilised lasers are key enablers of quantum technologies, with many cold atom applications reliant on multiple lasers. Quantum technology applications such as atomic clocks, magnetometers and gravitometers are now emerging from the laboratory and confronting the...
Chip on Board Assembly is the process whereby a bare semiconductor die is mounted on a substrate using conductive or non-conductive epoxies. Die are electrically connected using Au ball bonding or Al Wedge Bonding.
Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.
The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products. Incorporates a number of integrated circuits in a single package in a way that maintains the demanding form factor...
ALTER UK has extensive experience in the packaging high brightness LEDS (HB-LEDS). ALTER UK offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set ALTER UK...
Challenges with image sensors vs. standard microelectronics packaging Sensor and filter position, tilt and rotation. Particulate control Thermal management / noise reduction Stray light Optocap’s Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane...
Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including; CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA
Alter Technology (formerly Optocap), offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Alter Technology (formerly Optocap), can offer a risk...
A key function of an optoelectronic device is to manipulate light. As a result the packaging and assembly processes for many optoelectronic components can be significantly more complex than traditional microelectronic devices.
Alter Technology (formerly Optocap), offers customers support in both prototype/process development for RF Module packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing...
