Services & Capabilities
Optocap have experience in the assembly and packaging of a wide range of Photoni...
Chip on Board
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Chip on Board Assembly is the process whereby a bare semiconductor die is mounte...
System In Package
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The semiconductor industry requires higher levels of integration, lower costs an...
LED CHIP On Board
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ALTER UK has extensive experience in the packaging high brightness LEDS (HB-LEDS...
Image Sensor Assembly
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Challenges with image sensors vs. standard microelectronics packaging Sensor...
Fast-turn IC Assembly
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Alter Technology (formerly Optocap), also offer fast-turn IC assembly services i...
Laser Diode Packaging
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Alter Technology (formerly Optocap), offers customers support in both prototype/...
Photonic Packaging
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A key function of an optoelectronic device is to manipulate light. As a result t...
RF and Microwave
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Alter Technology (formerly Optocap), offers customers support in both prototype/...
MEMS Packaging
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Alter Technology (formerly Optocap) has experience in the assembly and packaging...
Space and HI-REL Assembly
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Alter Technology (formerly Optocap), is a leader in the design, manufacture and...