From Alter Technology, we are pleased to be able to offer to all our customers a series of totally specialized services, with the latest technologies and always looking to offer them an experience that is productive both in time and economy. Continue reading
Optocap have experience in the assembly and packaging of a wide range of Photonic Integrated Circuit (PIC) devices including Silicon PIC and InP PIC devices. A PIC is a photonic integrated circuit that integrates multiple photonic functions, such as lasers, detectors, modulators... Continue reading
Solder bumps versus Au bumps SAC305 solder has been included as a Bump Technology, as this tends to be the most common solder bump material. However, other common solder bump options such as SnPb, have similar thermal, electrical and mechanical properties. Table 5 below provides... Continue reading
Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension. Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early... Continue reading
Regulations for Fire Alarm Systems. Regulation 305/2011 / EU regulates the applicable requirements for all construction products within the European territory, including fire safety products. It is known that the CE Marking is mandatory in all products of the European market... Continue reading
The space between the chip and the substrate is typically filled with a non-conductive adhesive called the underfill material. The underfill material is dispensed around the edge of the die and capillary action pulls the material under the die. The under fill material provides... Continue reading
Laser Diode Packaging and Fiber Alignment The purpose of packaging for a laser diode is four-fold. Firstly, it provides electrical interconnection for the laser diodes, photodiodes, thermo-electric coolers, and any other components, to the outside world. Secondly, it provides an... Continue reading
Factors influencing selection of bump technology A number of options exist for bumping a semiconductor device including solder bumping, Au bumps and Cu pillar bumps. When selecting the optimal bump material to use a number of factors must be taken into consideration. These... Continue reading
Flip Chip Design and Process Considerations for High Speed MMIC and RF Devices When a MMIC or RF device is mounted with the backside attached to a metal base, it is necessary to join the RF pads of the MMIC and motherboard track with a wire or ribbon bond. However, these are... Continue reading
Au-Au Thermocompression or Thermosonic attachment Die can be presented with bumps facing down or bumps facing up. In order to ensure that the dies are presented correctly for flip chip assembly then bumps must be facing down. If the die is not presented in such a fashion then a... Continue reading
The satellite SAOCOM 1A, is the first of two identical satellites where it covers the development of active instruments operating in the microwave range. Put into orbit these satellites comes from the Argentine Government. Developed, manufactured and built in the southern... Continue reading
Scribe, break and dig method for glass axial lead and surface mount type diodes. The aim of this test is to inspect the die inside glass axial lead and surface mount type diodes. The testing is performed in accordance with MIL-STD-750, method 2101, and consists in deliberately... Continue reading
