The aim of this destructive test is to demonstrate that the internal materials, design, construction and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed to examine unsealed devices prior to capping to verify that... Continue reading
The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other... Continue reading
This test is performed to verify the structural quality of the glassivation layer in aluminium metallized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and... Continue reading
Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures. Continue reading
Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials. Since it is destructive to the part, FIB technology is used for micro-sectioning in... Continue reading
The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing... Continue reading
Scanning Acoustic Microscopy (SAM) is an inspection that uses focused sound to investigate, measure, or obtain an internal image of an object. It is commonly used in failure analysis and non-destructive evaluation. The semiconductor industry has found the SAM, particularly the C... Continue reading
Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT... Continue reading
is performed to evaluate the reliability of non-hermetic packaged solid-state devices that are likely to encounter humid environments during normal (ambient) operation. Also known as Pressure Cooker Test (PCT) or Unsaturated Pressure Cooker Test, the purpose of HAST is to... Continue reading
The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of coated product as well as control of... Continue reading
The purpose of this test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term... Continue reading
Burn-in test is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Continue reading
