Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts Continue reading
Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive... Continue reading
Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects. Continue reading
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique. Continue reading
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part. Continue reading
An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and... Continue reading
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality. Continue reading
Alter Technology has upgraded its Scanning Acoustic Microscopy capabilities by acquiring a new FineSAT V acoustic microscope from Hitachi. FineSAT V, the high-end model of the FineSAT series, combines advanced inspection features with the faster inspection speed currently... Continue reading
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems. Typical non-destructive testing activities involving EEE parts are grouped in three main categories: • Functional inspection (electrical... Continue reading
Scanning acoustic microscopy (SAM), also denominated acoustic micro imaging (AMI) and scanning acoustic tomography (SAT), is a consolidated and recognized tool for non-destructive quality control, inspection and failure analysis in microelectronics components and materials... Continue reading
In acoustic microscopy, resolution and inspection depth are inversely related parameter that depend on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must to be carefully selected in order to optimize the accuracy... Continue reading
C-SAM Inspection of Microelectronic parts. Internal (invisible) fabrication and materials defects can critically compromise the performance of encapsulated microelectronics parts. Similarly, accidental constructional failures (missing parts) and counterfeit suppose and non... Continue reading
