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  • alter technology madridEngineering and testing of Hi Rel Electronic Component
    • Radiation Testing Services Electronic Parts
    • COTS Commercial Off-The-Shelf | EEE Parts
    • Acceptance Tests
    • Counterfeit Detection, Authenticity Tests
    • Evaluation / Qualification
    • Electrical Characterization
    • Failure Analysis
    • Material & Processes
    • Microsectioning
    • Microwave & RF testing
    • Parts Engineering and Logistics – EEE Parts
    • Procurement Electronic Components | EEE Parts
    • Relifing
    • Scanning Acoustic Microscopy C-SAM
    • Screening
    • Tin Whiskers Growth
    • Vibration Testing | EEE Parts
    • Short Technical Notes – Discover how our laboratories work and how the components that need to be tested are treated.
  • Certification Equipment Testing
  • DRONES – Remotely Piloted Aircraft Systems RPAS
  • Packaging & Assembly
  • Innovation
  • News
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    • Alter Technology
    • ALTER FRANCE
    • ALTER UK

Video Channel

Alter Technology Web Project TV

Services, capabilities, webinar´s, broadcast.

Corporative Site

Defective glassivation test
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  • Acceptance tests
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Glassivation Integrity Electronic Components | EEE Parts

by Francisco Javier Aparicio Rebollo

This test is performed to verify the structural quality of the glassivation layer in aluminium metallized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and... Continue reading

Penetrant Dye Gross Leak
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  • Acceptance tests
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Penetrant Dye Gross Leak Electronic Components | EEE Parts

by David Ramirez - Cruzado

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures. Continue reading

Microsectioning
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  • Acceptance tests
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  • Material Processes

Focused Ion Beam (FIB) Micro-Sectioning | HI Rel Parts

by Francisco Javier Aparicio Rebollo

Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials. Since it is destructive to the part, FIB technology is used for micro-sectioning in... Continue reading

Cross sectioning Electronic Components
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  • Acceptance tests
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  • Microsectioning

Cross sectioning Electronic Components | EEE Parts

by Media ATN

The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing... Continue reading

Decapsulation testing services Electronic Components
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  • Acceptance tests

Decapsulation testing services Electronic Components | EEE Parts

by Francisco Javier Aparicio Rebollo

Decapsulation of packaged devices exposes the internal elements of the device under test. Opening devices by this method allows the inspection of the die, interconnects and other features typically examined during failure analysis (FA), constructional analysis (CA) and... Continue reading

C-SAM Test
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Scanning Acoustic Microscopy CSAM | EEE Parts

by Media ATN

Scanning Acoustic Microscopy (SAM) is an inspection that uses focused sound to investigate, measure, or obtain an internal image of an object. It is commonly used in failure analysis and non-destructive evaluation. The semiconductor industry has found the SAM, particularly the C... Continue reading

Lead Integrity Test Electronic Components
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Lead Integrity Test Electronic Components | EEE Parts

by Jesús Enrique Barbero Muñoz

Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT... Continue reading

incoming inspection electronic components
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  • Acceptance tests

Incoming Inspection Electronic Components | EEE Parts

by Antonio José Rey

The purpose of the incoming inspection is to identify potentially non-conforming parts, prior to placing the material in the inventory or moving it to the production flow. All parts and materials subject to receiving inspection are examined in accordance with customer purchase... Continue reading

Bond pull test
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Bond Pull Test Electronic Component | EEE Parts

by Jesús Enrique Barbero Muñoz

The purpose of this test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term... Continue reading

Destructive Physical Analysis DPA
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  • Acceptance tests

Destructive Physical Analysis DPA | EEE Parts

by Lope Rescalvo

Destructive Physical Analysis, dpa , is a systematic, logical, detailed examination of EEE parts during various stages of physical disassembly. This activity is performed to verify that the manufacturing lot quality and construction are in accordance with the detailed... Continue reading

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